Hi.
I’ve never had an issue with BL PC in the X1C, yet the comparison may be unfair as the print design can significantly impact the thermal gradient.
If you feel the issue is caused by low chamber temperature, I would advise trying a passive solution, such as improved thermal insulation. @Olias already shared a few solutions.
You may take other ideas from:
Best practices for thermal insulation? Maximum chamber temperature? - #9 by GekoPrime
If the insulation is not enough or the active chamber a must, trust @Olias as to forget simplicity. The heating system may be simple, but the proper integration into the X1C is challenging.
This would also be my main concern. Even if there aren’t immediately noticeable problems, I expect the electronics to have a shorter lifetime.
You may take a look at some interesting thoughts about the X1C component’s temperature limits:
I would start to design a heat insulation system for the electronics (at least for the ones possible). The main challenge may be the available space, but I guess adding some EPDM-based sheets and a fan for improved convection is possible.
With a properly thermal-insulated printer, the heat demand will be lower.
The ideal heating device(s) should be small for easy installation, allow modularity, and entail some "logic, " i.e., be controllable. A few options will suit the requirements, but I would first look at the printer’s thermal performance after the insulation mods for proper dimensioning.