Ok, I am talking about this article :
https://wiki.bambulab.com/en/h2/manual/laser-platform-cutting-platform-use-intro
So I am using material pins as attached but I honestly do not understand this English
The big material pins can only be installed on both sides of the laser platform, and cannot be vertically magnetically attracted on the grid panel, otherwise, the toolhead will be hit; the small material pins can be vertically magnetically attracted, but the operation requires extra attention, shen manually entering the material thickness in the software, it cannot be set to a thickness more than 2mm lower than the surface of the workpiece, and cannot turn on the focus sinking (see developer mode for details), otherwise, it will also cause the toolhead collision.
So what am I setting when I am using the small pins ? They also show a screenshot in the documentation - and that setting is nowhere to be seen. Nor do I see an option to enable developer settings
Can someone decipher this for me please ? I think this was written by a non native English speaker and I really struggle to ‘get it’.

