According to official specifications, the H2D supports:
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PLA
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PLA-CF
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PETG
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PETG-CF
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TPU
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PVA
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PA (limited support for PA/PA-CF)
Most of these materials, especially PLA, PETG, and TPU, do not benefit from active chamber cooling at standard ambient temperatures and actually suffer from it.
Curious what the difference would be , although this github post is concerned with the H2d , could it be a reason the H2s relies on venting either through the exhaust fan or the top vent , as im pretty sure both ways can help keep a temp constant
There is also this from the latest firware update