I ran into a niche but slightly annoying issue last night when switching from a high-temp material (PPA-CF) to a low-temp PLA print on the H2D. This might be a general BambuStudio issue but I don’t own any other Bambu printers.
I had just finished printing with PPA-CF, which requires a 70°C chamber temperature. After that job completed, I swapped plates and queued up a PLA print shortly after. I had to leave the house, so I expected the printer to handle chamber cooling automatically and start the next print once the chamber temperature dropped into an acceptable range.
Instead, I got a notification from Bambu Handy:
“Chamber temperature too high. Please remove the top glass and front door.”
Since I wasn’t home, I couldn’t physically remove the panels. I set the exhaust fan to max, but I noticed that the chamber temperature wasn’t dropping as quickly as expected.
That’s when I realized something: Even while waiting for the chamber to cool, the heatbed was still set to 55°C.
Naturally, this slows down cooling.
Of course, I could have easily manually set the bed temp to 0°C or removed the panels ahead of time—but I think this is an easy change to make the cooling process more optimal.
Suggestion:
When the printer detects that the chamber temperature is too high, it should temporarily disable the heatbed (set it to 0°C) during the cooling phase to speed things up.
Not a huge deal, also very niche, but it would make chamber cooling more optimal—especially for people running multiple materials or using remote workflows.
If you have a Smoke Purifier, it will cool down the chamber in no time. But loading low-temperature filament before the chamber temperature stabilizes under 40°C is basically asking for problems.
I never load low-temperature filament before the chamber temperature is well under 40°C – just to be sure.
This isn’t really a bug, but more of something that needs to be handled manually. How would you like it to work?
You’re printing at a chamber temperature of, let’s say, 65°C. That means everything in the chamber will be at that temperature or higher. Even if you open the door to cool it down quickly, the filament path might still be too hot for low-temperature filament, and you could end up with a clog from hell there.
I’ve also asked why it allows loading low-temperature filament while the chamber is too hot for that particular filament. I had a clog from hell on my X1 Carbon when switching between PAHT-CF and PLA Basic – solvable, but it took some extra minutes I hadn’t planned for!
Right, I’m not looking for a solution - I just found it odd that while attempting to cool down the chamber the heatbed stays set to 55°C, counteracting the cooling process.
It would be more optimal to set it to 0°C and begin heating afterwards.
It might seem odd, but you also need an evenly heated bed — so it’s a tradeoff between that and chamber cooling.
But honestly, there are quite a few odd things with the H2D. For example, why can’t the AMS2/HT maintain a preset humidity level? All the necessary electronics are already in place, and their competitors have been offering this feature for some time.
