Thanks for the response. Yea i tend to use 15% anyway. Not sure why I went higher on that. And I always use glue edge to edge. Which is why it managed to pull the plate of the magnet because it stuck so well. But yea thanks. Will play with a few settings. Only found the Bambu KB mentioning shrinkage at high infill after the event.
Also I doubt you can put a sticker on the engineering plate. First there is a distinct dip in now where the writing is missing plus the engineering plate is ever so slightly textured. Not PEI textured but textured none the less.
You can definitely do one side, I’m just not sure if you can do 2. Your plate already has a sticker on one side. The stickers are only .3mm so it might be ok to add a second sticker to the damaged side, just don’t know for sure.
That’s what the big spatula like print is on the card from the factory is for.
I managed to print it flipp 90 degrees but it just doesn’t work for the tolerances. It’s not a big deal anyway. I think there’s some merit that this is likely on the edge of a what the printer can do. I never had issues with ASA and even that lifts with this print.
I’ve seen custom carbon fibre resin build plates used with materials that want to warp. 2mm plate will be very stiff and resist lifting as a part cools
There’s one trick you can try and that is to set a bed temperature of just 50 degrees. What this does is makes the first layer shrink instantly and it doesn’t really look that good but the shrinkage on the rest of the print is then uniform as everything just cools right after printing. It might not work for you and I’m not sure what implications it has to mechanical properties, but this is in part why polymaker CoPA doesn’t need a closed chamber.