It does sound like heat creep from your description. What’s you chamber temp? I usually aim for 35-39°C with PLA, up to 35° with many retracts and below 35° wirh ironing.
Woodfill is much prone to take up moisture and will also react much more severly. In particular if have a warm spell atm? Or the AMS is dry because your PLA wood has kept the dessiccant dry? (Happened to me with other filaments: BVOH & isanmate 30% woodfill PLA) So it is possible that this causes heat creep even though you have printed this filament well beforehand.
More serious would be extruder slippages, wear or clogs. I noticed my isanmate woodfill to be more flexible when moist. That could contribute to clogging.
Similarly, aggregated durst in the extruder gears could impede extrusion, contributing to an earlier onset of heat creep.
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