Firmware request: Closed loop temperature control

I’m impressed with most thing about my Bambu but underwhelmed when it comes to chamber fan control. You should neither set fans to off for cool plate, nor set it to 60% for a heated plate, nor hint about opening the door or lid unless actually needed.

We already have a target chamber temperature setting but it appears to only be used by X1E for heating. ALL models with a chamber fan should use the very same setting for cooling!

So what you should do regardless of plate is obviously start out with no chamber fan, then turn it on if/when needed, and continuously adjust speed between 0 and 100% as needed. Among other benefits, this reduces fan noise, which is very high on my wish list. As soon as it reaches 100% (and only then!) you could also throw the warning suggesting to open the lid - and if user does so, the fan noise will hopefully decrease over time as temperature drops allowing the printer to decrease fan speed.

This is a trivial thing to implement. As far as I can see you don’t need to look at any other variable: Plate does not matter, filament type does not matter. The current vs. target chamber temperatures is the only parameters you need. So you can get rid of some profile G-codes with daft open loop “if PLA and Textured Plate then fan=70%” logic.

I know your request is for BBL to implement proper temperature control but I have one of these I intend to splice in to do the same job.

W3230 DC 12V 24V AC110-220V Probe Line Digital Temperature Control LED Thermostat Regulator Heat/Cooling Control Thermoregulator
https://a.aliexpress.com/_msIGmHa

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