So if the chamber is set to 65c and bed to 100-120c the temperature would likely equalize around 75-80c during long prints. My question is what is the maximum safe temp for the printer and it components in the hot zone? Would assume higher temp materials were used in H2D vs printers without chamber heating
In my direct real-world experience of running a 120C bed with a 65C chamber in a 22C room, it stays at 65C in the chamber.
While the printer is enclosed, it is not insulated.
I’m not sure if the exhaust fan would kick on to keep it down to 65C [I haven’t looked] so I can’t say for sure, but I suspect it may.
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Yeah… the 65C heater is tuned to stop at 65C. The bed shouldn’t make it go any higher, it will simply use less chamber heater if the bed heat causes the temp to rise.
Yea thats what I was looking into, insulation to increase the temp to 70-80c to get closer to glass transition temps of the high temp materials like PPA-cf to get even greater layer adhesion. So I guess the max safe temp is more of a question that Bambu Lab would have to answer.
Given that the nozzle camera disconnect at 83°C when chamber temp is at 65°C, I would not be confident you can increase too much the chamber temperature without issues on the electronics. There might be margin but it’s certainly already accounted for
Easy answer for ya: commercial electronic equipment should not exceed 70C operating temperature, per IEC 61010 (likely also in UL code).
This is why Bambu cuts it off at 65C.
You may be able to operate beyond 70C by a few degrees, but don’t be surprised if you run into a few issues, mechanically or electrically. 75C would be as far as I’d push it…
In case it doesn’t go without saying: operating the machine above 70C is voided warranty territory IMO.
Realistically, if you need to print a material that needs a higher than 65 °C chamber, you probably need a printer specifically designed and intended for that material.
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Absolutely agree. Roboze would be my go-to for the next temperature bracket. Their machines are built to digest CF-PEEK filament on the regular.
Dont, while you won’t have things melting, you would definitely have lots of things deforming. You can even have minor deforming already with 65C. In fact when you’re heating up the machine you can hear a lot of popping sounds, that’s the machine heating up and having some deformation.
The machine isn’t designed for higher temps, so probably don’t challenge it?
if you’re talking about bambu ppa-cf, no you generally won’t get better layer adhesion from it. it’s not the chamber’s fault, it’s the filament. bambu used 25% CF to increase the rigidity but it’s not “coated filament”, so the exposed CF would ruin the layer adhesion.
If you check SirayaTech, or Fusrock’s PPA-CF/PAHT-CF, they already have pretty good layer adhesion (at the same range of PLA, but the tensile strength/bending strength is slightly lower than bambu’s variant). Because they didn’t go for CF25. Then they also have the coated version (or, core version) to have the best of both worlds.
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