With the launch of the R1 , it’s clear laser is becoming a bigger focus for Bambu Lab. Before rolling out new laser hardware, it would be great to see some of the existing pain points on the H2 series laser/cutter module finally addressed?
This has already been reported over a year ago in this thread with no official follow-up from Bambu Lab: Can’t dry filament when laser/cutter is installed? .
Could Bambu Lab confirm:
- Whether this restriction is a hardware/power limitation or a firmware-level lockout?
- Whether enabling AMS drying during laser/cutting jobs is on the roadmap for a future firmware update?
Thanks for looking into this.