Hello everyone.
I have a X1C for roughly 1.5 years and have always experienced substantial bed adhesion problems with all filaments despite trying all common suggestions. Recently when the bed was at 70 degrees Celsius I noticed that I can touch it for a long time without it hurting so I started to doubt the temperature reading.
I have measured the bed temperature with two different devices: a short range IR thermometer and a digital cooking thermometer with metal contact probe. Both give substantially different readings than the printer (see photo’s)
When the printer claims 70°C:
- IR measures ±60.1°C.
- Probe measures 61°C.
Bed at 110°C:
- IR measures ±91.7°C.
- Probe measures 94°C.
The probe was clamped between the bed and PEI sheet and allowed to warm up for a few minutes with the door nearly closed.
The IR measurements have been performed multiple times on the black textured PEI, across the build plate, at ±3cm distance and against it, and even with a warmup time of roughly an hour.
As a benchmark I tested the probe on boiling water and the IR thermometer on my body temperature and a 70°C oven, which both measured correctly.
I used to have an Ender 3 which almost never has adhesion problems. But on the X1C probably 40% of my prints fail (rough guess). The temperature being way off might be the problem.
For low temperature filaments such as PLA I can just go higher but ASA and PC needs 100°C to 110°C which the printer apparently can’t reach.
Has anyone encountered this problem? I can’t find similar posts with such a big difference.
I can’t find information about the temperature sensor in the bed, I guess it cannot be replaced separately?
Any advice to fix this apart from a new bed?
