X1C Firmware V01.11.02.15 Now in Public Beta!

Bambu Lab X Series X Series Firmware Public Beta
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New X1C Firmware Available for Public Beta Testing!

We’re excited to announce that firmware V01.11.02.15 for the X1C is now available through our Public Beta Program.

How to Join the Beta
To access the beta firmware, simply join the Beta Firmware Program via the Bambu Handy app under Me → Beta Firmware Program.

Once enrolled, the update will be pushed to your device gradually.

:arrows_counterclockwise: Want to Switch Back?
You can leave the Beta Program at any time by disabling the option in the app and installing the latest official firmware version.

Feature Optimizations:

  1. Enhanced security: Includes essential security updates.

  2. Improved purge chute pile-up detection: When purge chute pile-up is detected during printing, the toolhead moves to a safe position to prevent filament from sticking to it.

  3. Farm operation optimization: After a farm print job completes, plate clearing confirmation can now be operate directly on the device screen.

  4. Fixed an issue where starting a print via sliced files store in machine’s memory can sometimes incorrectly report a nozzle type mismatch.

Please also note that if you find specific issues, bugs, or suggestion for improvement, we would appreciate it if you can share it via the Beta Feedback form.

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Hello. It’s a bit disappointing that the ability to dry filament in the AMS while printing wasn’t included in this beta firmware.

Is this feature still on the roadmap? Can we expect support for drying filament in the AMS during active prints in a future firmware update?

I believe this would be one of the most valuable features for users printing with hygroscopic materials like PETG, PA, PC, or TPU.

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I can’t agree more. I am chatting with support about this very thing.